🔧 Industrial Instrumentation Weekly Digest
Week of: June 15, 2026 – June 22, 2026
Your weekly update on pressure measurement, industrial IoT, and process automation news.
📅 June 19, 2026
- Servomex appoints new Global Sales Director
📝 Servomex, international expert in gas analysis, has appointed David Jones as Global Sales Director to lead and strengthen its worldwide commercial strategy. Based in the UK head office, David brings m
📰 Source: Instrumentation - Is your aerospace or defence technology engineered for mission-critical performance?
📝 Entries are now open for the Aerospace, Military & Defence Product of the Year category at the 2026 Instrumentation & Electronics Awards, with companies being invited to showcase the technologies supp
📰 Source: Instrumentation - ACI enhances operational capabilities with appointment of Isabelle Darcy
📝 Analytical Components International (ACI), a leading manufacturer of precision components for analytical instrumentation and innovator in the hard materials industry, specialising in synthetic sapphir
📰 Source: Instrumentation - Emerson to exhibit technologies that enhance machine performance at Automate 2026
📝 Emerson to exhibit technologies that enhance machine performance, accelerate OEM time to market at Automate 2026 (Booth 13054)… Global technology, software and engineering leader Emerson will present
📰 Source: Instrumentation - Sensys encourages process engineers to look beyond the pump when assessing chemical dosing reliability
📝 Chemical dosing systems rarely fail at the pump alone, according to Sensys, the official UK distributor for Iwaki. The company is encouraging process engineers, maintenance teams and technical specifi
📰 Source: Instrumentation - Chip Industry Week In Review
📝 Apple-Intel is on, says Trump; Amkor’s big win; Intel 18A-P; Amazon to sell its AI chips; Rambus’ automotive RoT; Brewer’s buy; VLSI Symposium tech; CHIPS Act funding; MIT sensor; RISC-V CPU fuzzing.📰 Source: SemiEngineering
- Waygate Unveils Future-Ready Krautkrämer PAXYS Platform for Industrial NDT
📝 Waygate Technologies, a leader in non-destructive testing (NDT) solutions for industrial and energy infrastructure inspection, has announced the launch of Krautkrämer PAXYS, a portable phased array (P
📰 Source: Metrology News - 8k Camera for Ultra-High-Speed Imaging in Low-Light Conditions Launched
📝 Teledyne DALSA, a leader in machine vision technology, has announced the release of its next-generation Linea HS2 8k backside illuminated (BSI) 1 MHz Time Delay Integration (TDI) camera.
The post 8k C
📰 Source: Metrology News - Structural origin of line-tension reversal in nanoscale wetting of water
📰 Source: Nature
📅 June 18, 2026
- Anritsu introduces Tensor VNA at IMS 2026
📝 Anritsu announced the launch of its new Tensor Vector Network Analyzer (VNA) at the IEEE MTT S International Microwave Symposium (IMS) 2026. The Tensor VNA represents a major advancement in RF and mic
📰 Source: Instrumentation - Ready to put your measurement technology in the spotlight?
📝 Entries are now open for the Test & Measurement Product of the Year category at the 2026 Instrumentation & Electronics Awards, with companies being encouraged to showcase the technologies helping engi
📰 Source: Instrumentation - ABB expands non-invasive sensing portfolio to advance simpler and safer temperature measurement
📝 ABB has expanded its NINVA non-invasive temperature measurement portfolio with the introduction of NINVA Integrated, NINVA Remote, and NINVA Compact. The new solutions are designed to address distinct
📰 Source: Instrumentation - Meet Fame LPIT: An innovative plug-in test systems for the energy transition
📝 With Fame LPIT, Phoenix Contact is presenting a new generation of plug-in test systems for low-power sensors in medium and high-voltage switchgear. The solution enables the fast, safe, and convenient
📰 Source: Instrumentation - Happy anniversary to PowTechnology’s Navya!
📝 Congratulations to Dr Navya Venkateshaiah, Lead Developer, who is celebrating her first anniversary with PowTechnology! We asked her to share her impressions after one year. “It’s been fascinating, ch
📰 Source: Instrumentation - Scaling ADAS To 10+ Cameras
📝 A robust OBGA packaging solution for automotive-grade reliability.
The post Scaling ADAS To 10+ Cameras appeared first on Semiconductor Engineering.
📰 Source: SemiEngineering - Accelerating GAA Logic Yield Optimization With Digital Twins
📝 Overcoming manufacturing variation at advanced nodes.
The post Accelerating GAA Logic Yield Optimization With Digital Twins appeared first on Semiconductor Engineering.
📰 Source: SemiEngineering - How To Build Billions of Bumps
📝 Hybrid bonding permits unprecedented connection density.
The post How To Build Billions of Bumps appeared first on Semiconductor Engineering.
📰 Source: SemiEngineering - VLSI 2026: Intel 18A Platform Momentum From Devices To Routed Designs
📝 Higher performance, backside power, and new materials.
The post VLSI 2026: Intel 18A Platform Momentum From Devices To Routed Designs appeared first on Semiconductor Engineering.
📰 Source: SemiEngineering - A New Fracture Engine For Curvilinear Masks And MULTIGON Mask Data
📝 Demand for better pattern fidelity and the adoption of ILT are increasing pressure to shift to curvilinear mask technology.
The post A New Fracture Engine For Curvilinear Masks And MULTIGON Mask Data
📰 Source: SemiEngineering - Randomizing Wafers To Zero In On Process Problems Much Faster
📝 Get the advantages of wafer randomization without extra equipment, cost or slowdown.
The post Randomizing Wafers To Zero In On Process Problems Much Faster appeared first on Semiconductor Engineering.
📰 Source: SemiEngineering - How to Create Efficient Bump and TSV Plans for Multi-Die Designs
📝 How to automate bump and TSV planning, visualization, and analysis, and also manage millions of interconnects while improving productivity.
The post How to Create Efficient Bump and TSV Plans for Mult
📰 Source: SemiEngineering - Automated 310mm Panel-Level Packaging to Accelerate AI Innovation: Tech Brief
📝 Supports higher throughput, reduced cycle time, and lower cost per package, while enabling integration of increasingly complex multi-die architectures.
The post Automated 310mm Panel-Level Packaging
📰 Source: SemiEngineering - GaN Power Devices Go Vertical
📝 Why new designs and process flows could help overcome manufacturing challenges.
The post GaN Power Devices Go Vertical appeared first on Semiconductor Engineering.
📰 Source: SemiEngineering - Schneider Electric Sets a New Benchmark for AI-Driven Inspection
📝 Schneider Electric set out to solve a pressing challenge: how to expand inspection coverage, increase throughput, and reduce manufacturing costs—without increasing complexity or reliance on individual
📰 Source: Metrology News - Camera Captures the Physics of Metal 3D Printing at 20,000 Frames per Second
📝 Researchers have demonstrated that the Allied Vision EoSens 3CL high-speed camera can reliably detect process signatures linked to subsurface defects in Laser Powder Bed Fusion (LPBF) — entirely in re
📰 Source: Metrology News
📅 June 17, 2026
- Laser Triangulation Sensors Measure Metal Wheel Rims Thickness
📝 In the production of metal wheels using the flow-forming process, it is necessary to check the thickness distribution on the round body after each deformation step. This helps to comply with the targe
📰 Source: Metrology News - Inbolt Launches Vision-Enabled Robot Programming – Closing the Loop from CAD to Factory Floor
📝 Inbolt, the robot intelligence company that turns digital twins into live robot control, is launching two new capabilities that complete the company’s AI vision model for robot guidance: Inbolt Robot
📰 Source: Metrology News - Uncovering Composite Damage Beneath the Surface
📝 In this article, Stephanie Williams, senior product specialist at composites testing instrumentation manufacturer Instron, explains how drop towers are key to Compression After Impact (CAI) testing.
T
📰 Source: Metrology News - Machine Vision Advances Automated Label Inspection and Identification
📝 Goods-in operations in the electronics industry are under increasing pressure. Countless components from a wide range of manufacturers arrive with constantly changing label layouts, multilingual marki
📰 Source: Metrology News - Cognex OneVision Adoption Ramps as Manufacturers Scale AI Vision Globally
📝 Cognex Corporation, the global leader in industrial machine vision, has announced the general availability of OneVision, its collaborative AI vision development environment designed to simplify and sc
📰 Source: Metrology News
Stay updated with the latest in industrial instrumentation.
🔗 Fandesensor – Industrial Pressure & Level Measurement Solutions
🕒 Published on: 6/22/2026, 12:31:08 AM
