🔧 Industrial Instrumentation Weekly Digest
Week of: September 21, 2026 – September 28, 2026
Your weekly update on pressure measurement, industrial IoT, and process automation news.
📅 September 25, 2026
- Comparing A7 CFET and A10 Nanosheet FETs From Parasitics to Chip Reliability (TUM, UNIMORE, Applied Materials)
📝 Researchers at the TU Munich, University of Modena and Reggio Emilia, and Applied Materials published a technical paper titled “System-Technology Co-Evaluation of A7 CFET and A10 NSFET Technologies fr
📰 Source: SemiEngineering - Farnell expands access to Emerson’s NI Nigel AI
📝 Farnell is expanding access to Emerson’s NI Nigel AI, a purpose-built AI technology for test and measurement. New enhancements, now available through Farnell, advance the technology from AI advisor to
📰 Source: Instrumentation - Newtek GE Series LVDTs provide high-precision displacement measurement for structural health monitoring
📝 NewTek GE Series spring-loaded LVDTs provide high-precision displacement measurement for structural health monitoring. These sensors assess the integrity and performance of buildings, bridges, and ot
📰 Source: Instrumentation - How do you build a connected factory that delivers results?
📝 By Tom Clayton, CEO, IntelliAM AI plc. Many manufacturers have invested in sensors, dashboards and predictive AI, yet still struggle to translate data into meaningful action. This article explores wha
📰 Source: Instrumentation - How are atomic clocks refined with AWG cards in PXIe format?
📝 Around the world, hundreds of atomic clocks are continuously compared to establish International Atomic Time (TAI). In Germany, the Physikalisch-Technische Bundesanstalt (PTB) contributes with two of
📰 Source: Instrumentation - Chip Industry Week In Review
📝 AI agents move deeper into chip design; China doubles down on AI compute and memory; chip supply chains tighten for equipment and critical materials; TSMC partners accelerate; ICs head to space; optic
📰 Source: SemiEngineering - digiVIT Enables Flexible Non-Contact Position and Displacement Measurement
📝 KMM Precision Measuring, manufacture of high-performance, precision non-contact position measuring systems, has highlighted the digiVIT digital variable impedance transducer for industrial application
📰 Source: Metrology News - Exaktera Brings Machine Vision Technologies Under One Global Brand
📝 Exaktera has brought together the expertise of specialty technology innovators under one global brand to create a single-source partner for reliable industrial machine vision components. Exaktera unit
📰 Source: Metrology News - A universal speed limit for collective decay in quantum systems
📰 Source: Nature - Quantum field theory dynamics in trapped ions
📰 Source: Nature - Aharonov–Bohm interference in a <InlineEquation ID=”IEq1″>
<EquationSource Format=”TEX”>$${\pmb{\mathbb{Z}}}_{\bf{2}}$$</EquationSource>
<EquationSource Format=”MATHML”><math>
<msub>
<mrow>
<mi mathvariant=”double-struck”>Z</mi>
</mrow>
<mrow>
<mi mathvariant=”bold”>2</mi>
</mrow>
</msub>
</math></EquationSource>
</InlineEquation> lattice gauge theory on a hybrid qubit–oscillator quantum computer
📰 Source: Nature - Universal scaling laws for correlated decay of many-body quantum systems
📰 Source: Nature - Quantum field theory dynamics on a spin–phonon quantum computer
📰 Source: Nature
📅 September 24, 2026
- Independent studies strengthen the evidence for quantitative optical gas imaging (QOGI)
📝 Quantitative Optical Gas Imaging (QOGI) has progressed from a promising innovation to a proven field technology, supported by a series of independent, peer-reviewed and industry-sponsored studies. The
📰 Source: Instrumentation - Avnet Silica strengthens sensing portfolio
📝 Avnet Silica, an Avnet company (AVT), has announced a new distribution agreement with LEM, a global provider of current and voltage measurement solutions. Under the agreement, Avnet Silica will offer
📰 Source: Instrumentation - KIT and TengTools win Innovation & New Product Award at Electra Mining Africa 2026
📝 Coplan Ltd and TengTools are proud to announce that Coplan’s digital tool control solution, KIT, has been named winner of the Innovation & New Product Award at Electra Mining Africa 2026, one of the c
📰 Source: Instrumentation - Teledyne unveils 100 Gbit/s imaging solution for advanced semiconductor inspection
📝 Teledyne Adimec and Teledyne DALSA will demonstrate a new Sony IMX927-based 100 Gbit/s imaging platform at VISION Stuttgart, taking place from 6 to 8 October 2026 in Stuttgart, Germany. Developed to a
📰 Source: Instrumentation - A Network-on-Chip (NoC) For Multi-Die Devices
📝 Transporting the native packetized traffic of the NoC directly across die boundaries using a stable, invariant interface.
The post A Network-on-Chip (NoC) For Multi-Die Devices appeared first on Semic
📰 Source: SemiEngineering - Managing 3D-IC Design And IP
📝 Design data management, traceability, and revision control are critical for multi-chiplet heterogeneous integration.
The post Managing 3D-IC Design And IP appeared first on Semiconductor Engineering.
📰 Source: SemiEngineering - When AI Agents Cross Chip Design Silos
📝 Specialization and orchestration are becoming more important as the role of AI agents in chip design widens, but coordination, control, and trust remain challenging.
The post When AI Agents Cross Chip
📰 Source: SemiEngineering - EDA’s Future Is Evidence-Driven Automation
📝 AI may accelerate semiconductor design, but users still need formal proof, semantic continuity, and auditable workflows to trust automation.
The post EDA’s Future Is Evidence-Driven Automation appear
📰 Source: SemiEngineering - AI-Driven Device Modeling For Next Generation Quantum Applications
📝 Extracting advanced compact models and overcoming their shortcomings using a hybrid ANN approach at cryogenic temperatures.
The post AI-Driven Device Modeling For Next Generation Quantum Applications
📰 Source: SemiEngineering - Autonomy Levels For Design Agents: L1 To L5 Explained
📝 Determining what a system can decide, the scope it owns, how work is validated, when it asks for help, and who remains accountable for fallback and final signoff.
The post Autonomy Levels For Design A
📰 Source: SemiEngineering - 3D Chips Push EDA Into New Territory
📝 As AI chips move to stacked, chiplet-based architectures, EDA vendors are reworking mature tools for cross-domain analysis, faster exploration, and agentic AI assistance.
The post 3D Chips Push EDA I
📰 Source: SemiEngineering - Renishaw Reports Record Revenue as Semiconductor and Aerospace Drives Growth
📝 Renishaw has reported record revenue and a significant improvement in profitability for its financial year ended 30 June 2026, with accelerating demand from semiconductor, aerospace and defence custom
📰 Source: Metrology News - SHINING 3D Expands Wireless 3D Metrology Lineup
📝 SHINING 3D has announced major updates and additions to its professional 3D digitizing and metrology lineup. Combining untethered wireless freedom, advanced laser configurations, and integrated metrol
📰 Source: Metrology News - Cognex Expands into Robotic Perception with RealSense Acquisition
📝 Cognex Corporation, a global leader in industrial machine vision, has announced that it has entered into a definitive agreement to acquire RealSense, a market leader in depth-sensing cameras and visio
📰 Source: Metrology News - Probing picosecond depairing currents in type-II superconductors
📰 Source: Nature - Strange metal behaviour from underlying bad metallicity
📰 Source: Nature - An information-theoretic proof of the Planckian bound for thermalization
📰 Source: Nature
Stay updated with the latest in industrial instrumentation.
🔗 Fandesensor – Industrial Pressure & Level Measurement Solutions
🕒 Published on: 9/28/2026, 12:30:21 AM
